The United States invented modern electronics and the means to manufacture in high volume. Many factors have contributed to the fact that most of the electronics we use today are now manufactured outside the U.S. New York State has been very proactive in encouraging investment in infrastructure, R&D, manufacturing and work force development. “Manufacturing USA,” funded by the sixteen federal agencies and offices including the departments of defense, energy, and commerce, helps to advance manufacturing by connecting people, ideas, and technology. A network of fourteen institutes, three in New York State, reach across manufacturing, government, and academia. “These public-private partnerships breathe life into promising early-stage research, propel new products to market — and secure the United States’ future.”
This talk will describe Binghamton University’s role in founding and actively leading R&D projects in NextFlex, the Manufacturing USA institute that works toward furthering development and adoption of the flexible hybrid electronics.
Mark D. Poliks is Empire Innovation Professor of Engineering, Professor of Systems Science and Industrial Engineering and Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. He holds joint faculty appointment in the Materials Science and Engineering Program at Binghamton. His research is in the areas of high performance electronics packaging, flexible hybrid electronics, materials, processing, roll-to-roll manufacturing, in-line quality control and reliability. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. He leads the New York State NextFlex activities and was named a 2017 NextFlex Fellow. He has authored more than one-hundred technical papers and holds forty-six US patents. Previously he held senior technical management positions at IBM Microelectronics and Endicott Interconnect. Poliks is a member of technical councils for the FlexTech Alliance, the Nanobio Manufacturing Consortium (NBMC) and NextFlex, and has served on the NextFlex Governing Council. He serves as the General Chair of 69th IEEE/EPS Electronics Components and Technology Conference (ECTC) and recently co-hosted a NextFlex/National Science Foundation Workshop on “Accelerating Innovative Manufacturing Technologies for Flexible Hybrid Electronics”
Event Location – Time – Cost:
The dinner meeting will be held at the TechWorks! – 321 Water Street in Binghamton, NY.
Networking and self-tours of the TechWorks! will begin at 5:30 pm. Dinner will be at approximately 6:00 pm with the program beginning at approximately 7:00 pm.
Cost is $20 for general admission, including program and dinner – $10 for students including dinner – $5 minimum venue cover charge for all other program attendees without dinner
Come early and experience the Technology of the Southern Tier at the TechWorks! Explore the vintage IBM 1401 computing system, see several Link Aviation flight simulators, observe the Link lunar lander command module simulator, watch the Universal Instruments printed circuit board “pick and place” component insertion machine in action, play the Link nickelodeon piano… and much, much more… with Southern Tier companies that represent the alphabet from “A to W.”
Please RSVP on this website Registration link.
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